Glowing blue circuit board with electronic components, creating a futuristic technological landscape. Components emit soft blue light against a dark background, conveying depth and advanced technology.

PCB Specifications

We offer a wide range of PCB specifications to meet your requirements. The table below introduces a few of them, but we can accommodate much more. Please contact us for more information.

FeatureSpecification
Single / Double sided0.2mm±0.1mm (0.008"±0.004")
4 layers0.4mm±0.1mm (0.016"±0.004")
6 layers0.6mm±0.1mm (0.024"±0.004")
8 layers0.7mm±0.1mm (0.028"±0.004")
10 layers0.8mm±0.12mm (0.032"±0.005")
12 layers1.2mm±0.12mm (0.048"±0.005")
Maximum PCB Thickness8.0mm ± 10%(0.315"±10%)
Materials AvailableFR4, High Tg(175), FR5, Halogen-Free, CEM1, CEM3, ISOLA, ROGERS, Aluminum Clad, Polyimide, Teflon
Max. Number of Layers / Copper Weight40 layers / Up to 12oz (Call for Info.)
Maximum PCB DimensionsSingle/Double-sided: 550mm x 800mm; Multi-layers: 550mm x 700mm (Call for Info.)
Minimum Trace Width / Space0.002" / 0.002" (0.051mm) ± 10%
Min. Drill Holes Size / Max. Aspect Ratio0.1mm (0.004") / 20
Bow&Twist / Layer-to-Layer Registration< 5/1000 / ± 0.003" (0.076mm)
O/S Testing / Controlled Impedance TesterAOI and Flying Probe Tester / Tektronix TDS8200 (Imped. Tolerance: ±5%)
Solder MaskGreen, Light Green, Matte Green, White, Extreme White, Black, Matte Black, Dark Brown, Yellow, Red, Blue, Matte Blue, Transparent, etc.
SilkscreenWhite, Black, Yellow, Red, Blue, Green, etc.
Surface FinishHASL, Lead Free HASL, Immersion Gold, Immersion Silver, Immersion Tin, O.S.P (Entek), Soft/Hard Gold Plating, ENEPIG, Gold Finger, Carbon, Peelable Mask, etc.
OthersBlind and Buried Vias, Via-in-Pad(non-conductive epoxy), Electroplating Vias Filling, Counterbore, Countersink, Z-axis Routing, Edge Plating, Castelliation, etc.